The focus of the previous sections was to provide an overview of recent developments and the current status of the AM industry. In this section we will highlight what we consider some of the main trends that will shape the AM market in the coming years. We therefore highlight the main trends and drivers within hardware and software, materials and on the AM market.
We expect that technological innovations from existing players and new entrants will have the biggest impact on the AM industry. Some of the main trends from our point of view are:
Low productivity and thus high cost per part is often the biggest limiting factor when it comes to the usage of AM for serial production. Machine manufacturers are therefore continuously pushing the boundaries of productivity of existing technologies.
Using the example of metal Laser Powder Bed Fusion, the most widely used metal process, we can see the following developments:
It is hard to predict the kind of processes that will come up in the coming years, but simply looking at technologies that have already been announced gives a good impression of what to expect. Some of our highlights are:
Given the attention from investors, OEMs and end users, we expect to see many more such applications over the coming years. One trend across all these innovations is that it will not replace existing technologies but instead enable completely new applications.
Another trend we expect to continue is the increased usage of software across all steps of the value chain. This is an important development, since even though the AM processes itself are very digital, surrounding processes are often still performed manually. Some advancements we expect are:
Besides using software to enhance the AM process, automation has been one of the main hurdles for AM towards becoming a technology for serial production. Some of the main areas that require automation are:
Automating these steps will not only drive down costs, especially for high-volume applications, but also increase the repeatability of the process.
One trend that could be seen across all technologies, but probably most notably for Metal Laser Powder Bed Fusion (L-PBF) is the introduction of new machines with bigger build volumes. While some machine manufacturers simply increase the build volume of existing machines, other manufacturers developed innovative processes to solve issues such as gas flow. Selected examples are:
In recent years, competition in the additive manufacturing market has surged, particularly with the entry of Chinese companies into Western markets. These new players have introduced aggressive pricing strategies, creating significant price pressure across the industry. As a result, several established companies have faced financial struggles, leading to bankruptcies or forced mergers to remain competitive. This evolving landscape underscores the need for innovation and efficiency to thrive in a rapidly maturing market.
The second area that we expect to continuously advance Additive Manufacturing is materials. The main trends we observe in this area are:
A low number of qualified materials is one of the main hurdles for many processes. We expect to see more and more established materials being qualified for different processes. Some developments where we foresee a high impact are:
Since Additive Manufacturing is still a fairly novel process compared to conventional manufacturing technologies such as casting or millling, it was a logic step to use known materials and processing them with AM. Since companies built up more trust and experience with AM technologies, a logic next step is to develop materials that are optimized for Additive Manufacturing and are hard to produce with other technologies. Promising examples include:
Even though feedstock used for metal AM is significantly more expansive than conventional materials, the main cost driver for many processes lies in a different area: low printing speed. Especially for metal Laser Powder Bed Fusion the usage of machines is the main cost driver. There are several companies addressing this, among them are:
The feedstock used for Additive Manufacturing technologies are usually significantly more expensive compared to materials used for conventional manufacturing processes. We expect the decline in prices we have seen over the last years to continue, among others for the following reasons:
Multi-material printing is a reality for extrusion based processes for several years. Machines can easily be equipped with multiple different feedstock and change between them during the process. However, multi-matieral printing for other processes, especially powder-based, is more challenging. More recently, interesting advances have been made:
Change is not only happening in the fields of technology and materials. The AM market is rapidly evolving and we are certain that his trends will continue in the years to come.
In this section we would like to highlight some of the main trends on the AM market and some of the organizations that we believe will shape the market in the years to come.
While there were hardly any players in the AM market that were publicly listed in the early 2000s, this has significantly changed since then. After Stratasys was the first AM-company to go public in 1994, more players such as 3D SYSTEMS, MATERIALISE and EXONE have followed in the years to come to fuel their future growth ambitions. Some of the more recent IPOs that will have a great influence on the AM market are
Being successful on the AM market requires deep knowledge in a broad range of skills, including design for AM capabilities, materials science, printing capacity and application knowledge. Due to the increasing complexity of the AM market it is getting tougher for companies to capture all of these topics by themselves. We therefore see increasing collaboration between different players. Some good examples for this include:
The AM industry has seen a wave of consolidation and divestments in recent years as companies adapt to intensifying competition, economic pressures, and shifting market dynamics. The post-hype reality of AM has forced many players to reassess their business strategies, leading to mergers, acquisitions, and the exit of underperforming or niche-focused firms. Larger corporations are acquiring smaller startups to gain access to innovative technologies, such as advanced materials or specialized hardware, while also broadening their market reach. Simultaneously, some companies are divesting non-core assets or divisions to focus on more profitable or scalable segments of the AM value chain. This trend has been amplified by the entry of aggressive competitors, particularly from China, who bring cost-effective technologies to Western markets, creating significant price pressures. While this consolidation phase reflects growing pains for the industry, it also signals maturation, as the remaining players are often better positioned to deliver robust solutions, scale production, and drive innovation for industrialized applications.
The overarching trends outlined in the previous sections were initially written in 2021 and have since been updated to reflect the latest insights. This section delves into the most recent advancements within the AM market, composed at the beginning of 2024.
Despite the challenges posed by the COVID-19 pandemic, the AM industry has demonstrated remarkable resilience compared to its other industries. However, 2023 proved to be a demanding year for many AM enterprises, including machine OEMs, material suppliers, and part manufacturers. Particularly notable were the struggles faced by publicly listed entities, often enduring significant devaluations of their stock prices. Additionally, the year was marked by the much-debated merger proposal between STRATASYS and DESKTOP METAL, a story that involved 3DSYSTEMS and NANO DIMENSION. While the merger did not materialize, the possibility remains open for further developments in 2024.
Assessing the trajectory of the AM industry as a whole has become increasingly intricate, given the diverse behaviors observed across different geographic regions, industries, and applications. Notably, sectors such as defense and space have witnessed substantial growth, a trend expected to persist. Similarly, the semiconductor industry is experiencing a surge in attention.
End users are placing heightened emphasis on the environmental impact of AM processes. Disruptions in the global supply chain, coupled with political uncertainties, have intensified the focus on local production and the utilization of AM to enhance supply chain resilience. While companies are not expected to entirely relocate their manufacturing operations or replace traditional methods with AM, the technology remains a cost-effective solution for producing select components in close proximity to customers. This inclination towards localized production is anticipated to gain momentum in 2024 and beyond.
The sinter-based AM (SBAM) technologies have, as the name suggests, the sintering process in common. In this process, the printed green part is consolidated into a dense part and receives its final properties. The green part can be printed in advance using different technologies.They all have in common that metal powder is bound to the desired shape by a binder. The best-known printing technologies include Binder Jetting and Filament Material Extrusion.
In this section, you learn everything about the sinter-based AM process chain and get an overview of the different printing technologies.
This course is aimed at engineers, designers and other professionals that are working closely with sinter-based AM technologies. The goal is to cover the most important aspects that will enable engineers and designers to fully grasp the capabilities and technical limitations of the printing technologies and the sintering process to succeed in technology selection and part design. Besides going through the course from the beginning until the end, this course can also act as a constant source of knowledge while working on AM projects.
The course is structured into the following sections.
This section will start with an overview of the sinter-based AM process chain and its printing technologies, followed by a technology deep dive into the most important aspects of the BJT technology, followed by a closer look at the debinding and sintering step also including sintering simulation .
The second section will provide an overview of the different materials that are available as well as part characteristics that can be achieved with the BJT process and typical methods for quality assurance. Finally, several common defects in the BJT process are presented.
The last section will act as a guideline for designers. Besides generally describing the process when designing for Additive Manufacturing, actionable restrictions and guidelines for the BJT process are provided. The final section will present several design examples from different industries.
Simulation to compensate the deformation during the sintering step, nesting of parts and definition of printing parameters
Through various printing processes, different feedstocks such as metal powders, filaments, pellets or dispersions are processed into green parts
Unpacking of fragile green parts needs to be done carefully and is typically a manual process.
Debinding describes the process of removing the binder which results in a brown part
To reach the structural integrity of a metal part, a sinter process is required. The powder particles fuse together to a coherent, solid structure via a mass transport that occurs at the atomic scale driven via diffusional forces.
The brown part shrinks ~13-21 % in each direction.
The process chain of sinter-based technologies differs from other AM Technologies. Especially the post-printing processes (debinding and sintering) are crucial to achieve the intended mechanical properties.
Binder Jetting is a powder based Additive Manufacturing technology in which a liquid polymer binder is selectively deposited onto the powder bed binding the metal particles and forming a green body.
The metal powder is applied to a build platform in a typical layer thickness of 40 µm to 100 µm. Subsequently a modified 2D print head apply a binder selectively onto the powder bed. Depending on machine technology a hardening or curing process of the binder is performed in parallel for each layer and/or at the end of the whole build. During the in-situ curing process a heat source is used to solidify the binder and form a solid polymer – metal powder composite.
Afterwards the build platform moves downward by the amount of one layer thickness and a new layer of powder is applied. Again, the liquid binder is deposited and hardened in the required regions of the next layer to form the green body. This process is repeated until the complete part is printed. After the complete printing process is finished the parts have to be removed from the “powder cake” meaning the surrounding loose but densified powder. To improve the removal of the excess powder from the green body often brushes or a blasting gun with air pressure are used.
To create a dense metal part the 3D printed green body has to be post-processed in a debinding and sintering process. Similar to the metal injection molding process BJT parts are placed in a high temperature furnace, where the binder is burnt out and the remaining metal particles are sintered together. The sintering results in densification of the 3D printed green body to a metal part with high densities of 97 % to 99,5%, dependent of the material.
In classic Binder Jetting systems such as the ones distributed by EXONE or DIGITAL METAL the liquid binding agent is selectively deposited with a single print head. Meaning the width of the print head does not cover the full width of the powder bed. Therefore, the print head moves multiple times in xy-direction over the powder bed to completely cover the printing area and distributing the polymer binder.
The SINGLE PASS JETTING technology was developed by DESKTOP METAL and HEWLETT PACKARD. The width of the printing head covers the full width of the powder bed. When the printhead passes over the powder bed, binder is released from more than 30,000 small nozzles and the whole powder layer is selectively immersed in binder in one pass. The process is bi-directional which means that the binder deposition takes place in both moving directions of the printhead. With these modifications the printing speed is significantly increased.
A similarly fast technology is the METAL JET process by HEWLETT PACKARD. In a single pass, a liquid printing agent is applied to the powder layer and subsequently partially evaporated to form the binding polymer around the metal powder. After the completion of the print an additional curing to achieve the full green body stability is needed.
3DEO combines the Binder Jetting process with a subsequent machining process. Different from conventional Binder Jetting processes, the binder is not only deposited selectively but onto the entire powder layer. After hardening of the complete layer, the part geometry is shaped through a milling process every couple of layers by cutting the part contour out of the binder powder composite.
Binder Jetting is a powder based Additive Manufacturing technology in which a liquid polymer binder is selectively deposited onto the powder bed binding the metal particles and forming a green body.
The metal powder is applied to a build platform in a typical layer thickness of 40 µm to 100 µm. Subsequently a modified 2D print head apply a binder selectively onto the powder bed. Depending on machine technology a hardening or curing process of the binder is performed in parallel for each layer and/or at the end of the whole build. During the in-situ curing process a heat source is used to solidify the binder and form a solid polymer – metal powder composite.
Binder Jetting is a powder based Additive Manufacturing technology in which a liquid polymer binder is selectively deposited onto the powder bed binding the metal particles and forming a green body.
The metal powder is applied to a build platform in a typical layer thickness of 40 µm to 100 µm. Subsequently a modified 2D print head apply a binder selectively onto the powder bed. Depending on machine technology a hardening or curing process of the binder is performed in parallel for each layer and/or at the end of the whole build. During the in-situ curing process a heat source is used to solidify the binder and form a solid polymer – metal powder composite.
Binder Jetting is a powder based Additive Manufacturing technology in which a liquid polymer binder is selectively deposited onto the powder bed binding the metal particles and forming a green body.
The metal powder is applied to a build platform in a typical layer thickness of 40 µm to 100 µm. Subsequently a modified 2D print head apply a binder selectively onto the powder bed. Depending on machine technology a hardening or curing process of the binder is performed in parallel for each layer and/or at the end of the whole build. During the in-situ curing process a heat source is used to solidify the binder and form a solid polymer – metal powder composite.
Binder Jetting is a powder based Additive Manufacturing technology in which a liquid polymer binder is selectively deposited onto the powder bed binding the metal particles and forming a green body.
The metal powder is applied to a build platform in a typical layer thickness of 40 µm to 100 µm. Subsequently a modified 2D print head apply a binder selectively onto the powder bed. Depending on machine technology a hardening or curing process of the binder is performed in parallel for each layer and/or at the end of the whole build. During the in-situ curing process a heat source is used to solidify the binder and form a solid polymer – metal powder composite.